ABOUT THE COMPANY
Empower Semiconductor, based in Silicon Valley, powers the AI revolution with its FinFast™ technology by reducing the energy footprint and total cost of ownership of data centers. Its transformational integrated voltage regulators deliver on-demand scalable power with the speed, precision and signal integrity required by AI processors. Empower’s power-management architecture shrinks solution footprint, height and component count, achieving vertical power delivery with unprecedented power density and efficiency.
We are looking for a highly skilled and proactive Manufacturing Engineer to join our operations team. In this pivotal role, you will be responsible for managing and optimizing our relationships with key outsourced manufacturing partners (OSATs). You will drive operational excellence, ensure product quality, and secure efficient delivery from our subcontractors, playing a direct role in our product success and supply chain resilience. You will be instrumental in ensuring the smooth operation of our OSAT’s production lines, improving yield and reducing costs. This role will require a strong coordination skill and multi-tasking capability. This role will be ideally located in Shenzhen, China.
ROLE AND RESPONSIBILITIES
- Subcontractor Performance Management:
- Monitor, analyze, and report on subcontractor performance metrics, including yield, quality (DPM, AQL), on-time delivery (OTD), cycle time, and cost.
- Utilize statistical process control (SPC) and other data analysis techniques to monitor process stability and identify trends.
- Conduct regular business and technical reviews with subcontractors to track progress, identify deviations, and drive corrective actions.
- Lead root cause analysis (RCA) and implement corrective and preventive actions (CAPA) for quality excursions, yield issues, and delivery delays originating at the subcontractor site.
- Drive continuous improvement initiatives at subcontractor facilities to optimize processes, reduce costs, and enhance quality and efficiency.
- New Product Introduction (NPI), Qualification & Technology Transfer:
- Collaborate with internal R&D, design, and product engineering teams to define manufacturing requirements for new products.
- Lead the technical qualification and ramp-up of new products at subcontractor sites, ensuring successful process transfer and mass production readiness.
- Assess subcontractor capabilities for new technologies and package types.
- Review and approve subcontractor process flows, control plans, and test plans for new products.
- Participate in the transfer of new products and technologies from R&D to high-volume manufacturing.
- Process and Quality Assurance:
- Ensure strict adherence to company quality standards, specifications, and manufacturing procedures at subcontractor facilities.
- Conduct regular process and quality audits at subcontractor sites to ensure compliance and identify areas for improvement.
- Act as the primary technical interface for all production and quality-related issues with assigned subcontractors.
- Collaborate with quality assurance teams on failure analysis (FA) and reliability testing.
- Capacity & Supply Chain Management:
- Work closely with planning and supply chain teams to forecast capacity needs and allocate production across subcontractors.
- Identify potential supply chain risks and develop mitigation strategies.
- Support negotiations of technical aspects of contracts and service level agreements (SLAs) with subcontractors.
- Technical Support & Communication:
- Provide technical guidance and support to subcontractors to resolve manufacturing challenges.
- Communicate complex technical information effectively to both internal and external stakeholders, including senior management.
- Maintain comprehensive documentation of subcontractor processes, performance, and communication.
QUALIFICATIONS
- Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field.
- 5+ years of experience in semiconductor manufacturing, with significant exposure to backend processes (assembly, packaging, test) or foundry operations.
- Proven experience working directly with OSATs or managing external manufacturing relationships.
- Strong understanding of semiconductor assembly processes (e.g., wafer bumping, dicing saw, die attach, wire bonding, molding, singulation) and/or final test processes (ATE programming, test methodology).
- Familiarity with semiconductor quality standards (e.g., ISO 9001).
- Proficiency in data analysis, statistical process control (SPC), and problem-solving methodologies (e.g., 8D, FMEA, DOE).
- Excellent communication, negotiation, and interpersonal skills.
- Ability to travel frequently (domestic and international) to subcontractor sites as required.
- Strong project management skills, with the ability to manage multiple projects concurrently.
- Multilingual abilities, fluent in English and Mandarin Chinese
- Experience with specific semiconductor packaging technologies (e.g., SiP, BGA, QFN, WLP, Fan-Out, 3D IC) a plus
- Knowledge of MES (Manufacturing Execution Systems) and factory automation a plus
- Lean Manufacturing or Six Sigma certification a plus
- Experience with contract manufacturing or supply chain management in other high-tech industries a plus
举报职位
