Job Description
To provide technical support for new product introduction at subcons.Ensures that technical, quality, schedule and cost requirements areachieved.
In your new role you will:
- Be responsible for technical support of new product/package/new processdevelopment.
- Ensure that the project meets customer requirements in terms oftimeline, cost and quality
- Assess and mitigate technical risks
- Provide design proposal for package, lead frame, substrate and Cu-clip of new products
- Close interaction with the project manager, subcon interface, chip designer, application team, marketing and business units for new product design and project roadmaps
- Provide technical direction related to problem solving of process andreliability issues
- Closure of Package Development related deliverables and documents Technical Documentation thru Delta analysis DFMEA, PFMEA, Process Flow& Control plan
Your Profile
You are best equipped for this task if you have:
- Master / Bachelor Degree in Engineering and Physical Science
- 5+ years of Package/Process development in semiconductor packaging
- Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation
- Proficiency in AutoCAD for 2D drawing. Knowledge using 3D software(e.g. AutoCAD 3D, Inventor, and SolidWorks) is an advantage
- Exposure to the development of a wide variety of packages: TO, QFN, CuClip, Flip Chip, SOIC, QFP
- Knowledge on package design rules, FA techniques, assembly processes
- Ability to interpret package simulation results. Knowledge on package simulation software (e.g. ANSYS, SolidWorks) for FEA & thermal analysisis an advantage
- Knowledge on DFMEA during design phase and ability to create strategy to mitigate risk
- Excellence in statistical analysis that can provide a clear directionbased on package/process DOE Knowledge in IP management and patent filing
Contact:
lucy.shi@infineon.cn
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